U.S. Innovation, Manufacturing Are Alive and Well. Exhibit A: IBM and 3M Collaborate on 3D Chips
"Such three-dimensional structures could be 1,000 times faster than today’s individual chips, IBM estimates, ushering in much more powerful portable devices, PCs and server systems. Electronics companies now routinely stack a few chips together–particularly memory chips, for use in small devices like cellphones–but IBM is talking about bonding 100 or more chips together, including high-performance microprocessors.What role will 3M play?
"Microprocessors generate heat, and gluing chips together would cause them to melt. That’s where 3M comes in. The Minnesota-based materials company will work with IBM to develop special heat-dissipating adhesives that can safely conduct heat away from chips, and processes that can coat hundreds or thousands of chips with glues at one time."
"You want to ultimately make a brick of silicon,” says Bernard Meyerson, IBM’s vice president of research. “That does not exist today.”